Microstructure and thermal parameters of da Ni-modified Sn-2.0wt.%Ag hypoeutectic alloy
Solidification; Sn-Ag-Ni alloys; Microstructure; Thermal Parameters; Mechanical Properties.
The addition of nickel (Ni) in tin-based alloys applied to electronic microcomponents has received special attention in recent years. Ni promotes changes in mechanical properties such as hardness, mechanical strength, toughness, creep resistance, and electrical properties. In this context, the present study aims to understand the effect of Ni additions (0.2wt.%, 0.5wt.% and 1wt.% by weight) on the thermal solidification parameters such as cooling rate (Ṫ L ) and growth rate (V L ), in the of microstructure (with the possibility of dendritic, cellular and/or eutectic morphologies) and in the mechanical properties such as hardness, mechanical resistance and toughness, and fracture micromechanisms (fragile or ductile) of the hypoeutectic Sn-2wt.% Ag (by weight) alloy directionally solidified under under transient conditions. Experimental correlations will be carried out and discussed involving the Sn-2wt.% Ag-xNi alloys.